Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process

ABSTRACT

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a split laser beam laser scribing process, such as a split shaped laser beam laser scribing process, to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.

BACKGROUND

1) Field

Embodiments of the present invention pertain to the field ofsemiconductor processing and, in particular, to methods of dicingsemiconductor wafers, each wafer having a plurality of integratedcircuits thereon.

2) Description of Related Art

In semiconductor wafer processing, integrated circuits are formed on awafer (also referred to as a substrate) composed of silicon or othersemiconductor material. In general, layers of various materials whichare either semiconducting, conducting or insulating are utilized to formthe integrated circuits. These materials are doped, deposited and etchedusing various well-known processes to form integrated circuits. Eachwafer is processed to form a large number of individual regionscontaining integrated circuits known as dice.

Following the integrated circuit formation process, the wafer is “diced”to separate the individual die from one another for packaging or for usein an unpackaged form within larger circuits. The two main techniquesthat are used for wafer dicing are scribing and sawing. With scribing, adiamond tipped scribe is moved across the wafer surface along pre-formedscribe lines. These scribe lines extend along the spaces between thedice. These spaces are commonly referred to as “streets.” The diamondscribe forms shallow scratches in the wafer surface along the streets.Upon the application of pressure, such as with a roller, the waferseparates along the scribe lines. The breaks in the wafer follow thecrystal lattice structure of the wafer substrate. Scribing can be usedfor wafers that are about 10 mils (thousandths of an inch) or less inthickness. For thicker wafers, sawing is presently the preferred methodfor dicing.

With sawing, a diamond tipped saw rotating at high revolutions perminute contacts the wafer surface and saws the wafer along the streets.The wafer is mounted on a supporting member such as an adhesive filmstretched across a film frame and the saw is repeatedly applied to boththe vertical and horizontal streets. One problem with either scribing orsawing is that chips and gouges can form along the severed edges of thedice. In addition, cracks can form and propagate from the edges of thedice into the substrate and render the integrated circuit inoperative.Chipping and cracking are particularly a problem with scribing becauseonly one side of a square or rectangular die can be scribed in the <110>direction of the crystalline structure. Consequently, cleaving of theother side of the die results in a jagged separation line. Because ofchipping and cracking, additional spacing is required between the diceon the wafer to prevent damage to the integrated circuits, e.g., thechips and cracks are maintained at a distance from the actual integratedcircuits. As a result of the spacing requirements, not as many dice canbe formed on a standard sized wafer and wafer real estate that couldotherwise be used for circuitry is wasted. The use of a saw exacerbatesthe waste of real estate on a semiconductor wafer. The blade of the sawis approximate 15 microns thick. As such, to insure that cracking andother damage surrounding the cut made by the saw does not harm theintegrated circuits, three to five hundred microns often must separatethe circuitry of each of the dice. Furthermore, after cutting, each dierequires substantial cleaning to remove particles and other contaminantsthat result from the sawing process.

Plasma dicing has also been used, but may have limitations as well. Forexample, one limitation hampering implementation of plasma dicing may becost. A standard lithography operation for patterning resist may renderimplementation cost prohibitive. Another limitation possibly hamperingimplementation of plasma dicing is that plasma processing of commonlyencountered metals (e.g., copper) in dicing along streets can createproduction issues or throughput limits.

SUMMARY

Embodiments of the present invention include methods of, and apparatusesfor, dicing semiconductor wafers.

In an embodiment, a method of dicing a semiconductor wafer having aplurality of integrated circuits involves forming a mask above thesemiconductor wafer, the mask composed of a layer covering andprotecting the integrated circuits. The mask is then patterned with asplit shaped laser beam laser scribing process to provide a patternedmask with gaps, exposing regions of the semiconductor wafer between theintegrated circuits. The semiconductor wafer is then plasma etchedthrough the gaps in the patterned mask to singulate the integratedcircuits.

In another embodiment, a method of dicing a semiconductor waferincluding a plurality of integrated circuits involves laser scribing thesemiconductor wafer with a split shaped laser beam laser scribingprocess to singulate the integrated circuits. The method also involves,subsequent to laser scribing the semiconductor wafer, performing aplasma-based cleaning operation to clean sidewalls of the singulatedplurality of integrated circuits.

In another embodiment, a system for dicing a semiconductor wafer havinga plurality of integrated circuits includes a factory interface. Thesystem also includes a laser scribe apparatus coupled with the factoryinterface and having a laser assembly configured to provide a splitshaped laser beam. The system also includes a plasma etch chambercoupled with the factory interface.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a Flowchart representing operations in a method of dicing asemiconductor wafer including a plurality of integrated circuits, inaccordance with an embodiment of the present invention.

FIG. 2A illustrates a cross-sectional view of a semiconductor waferincluding a plurality of integrated circuits during performing of amethod of dicing the semiconductor wafer, corresponding to operation 102of the Flowchart of FIG. 1, in accordance with an embodiment of thepresent invention.

FIG. 2B illustrates a cross-sectional view of a semiconductor waferincluding a plurality of integrated circuits during performing of amethod of dicing the semiconductor wafer, corresponding to operation 104of the Flowchart of FIG. 1, in accordance with an embodiment of thepresent invention.

FIG. 2C illustrates a cross-sectional view of a semiconductor waferincluding a plurality of integrated circuits during performing of amethod of dicing the semiconductor wafer, corresponding to operation 108of the Flowchart of FIG. 1, in accordance with an embodiment of thepresent invention.

FIG. 3 illustrates three different scenarios for asymmetric beamsplitting, in accordance with an embodiment of the present invention.

FIG. 4A is a flowchart representing operations of a laser scribingprocess with the intensity control of split beams, in accordance with anembodiment of the present invention.

FIG. 4B illustrates a Gaussian laser beam profile 410 for a laser beamsplitting process, in accordance with an embodiment of the presentinvention.

FIG. 4C illustrates a Gaussian beam propagation in the beam path 420, inaccordance with an embodiment of the present invention.

FIG. 5A is a flowchart representing operations of a laser scribingprocess with split intensity control of a line shaped beam, inaccordance with an embodiment of the present invention.

FIG. 5B illustrates a Gaussian laser beam profile for a laser beamsplitting process, in accordance with an embodiment of the presentinvention.

FIG. 5C illustrates a line shaped flat top beam profile, in accordancewith an embodiment of the present invention.

FIG. 6 illustrates the effects of using a laser pulse width in thefemtosecond range, picoseconds range, and nanosecond range, inaccordance with an embodiment of the present invention.

FIG. 7 illustrates a cross-sectional view of a stack of materials thatmay be used in a street region of a semiconductor wafer or substrate, inaccordance with an embodiment of the present invention.

FIGS. 8A-8D illustrate cross-sectional views of various operations in amethod of dicing a semiconductor wafer, in accordance with an embodimentof the present invention.

FIG. 9 illustrates a block diagram of a tool layout for laser and plasmadicing of wafers or substrates, in accordance with an embodiment of thepresent invention.

FIG. 10 illustrates a block diagram of an exemplary computer system, inaccordance with an embodiment of the present invention.

DETAILED DESCRIPTION

Methods of dicing semiconductor wafers, each wafer having a plurality ofintegrated circuits thereon, are described. In the followingdescription, numerous specific details are set forth, such as split beamlaser scribing approaches and plasma etching conditions and materialregimes, in order to provide a thorough understanding of embodiments ofthe present invention. It will be apparent to one skilled in the artthat embodiments of the present invention may be practiced without thesespecific details. In other instances, well-known aspects, such asintegrated circuit fabrication, are not described in detail in order tonot unnecessarily obscure embodiments of the present invention.Furthermore, it is to be understood that the various embodiments shownin the Figures are illustrative representations and are not necessarilydrawn to scale.

A hybrid wafer or substrate dicing process involving an initial laserscribe and subsequent plasma etch may be implemented for diesingulation. The laser scribe process may be used to cleanly remove amask layer, organic and inorganic dielectric layers, and device layers.The laser etch process may then be terminated upon exposure of, orpartial etch of, the wafer or substrate. The plasma etch portion of thedicing process may then be employed to etch through the bulk of thewafer or substrate, such as through bulk single crystalline silicon, toyield die or chip singulation or dicing. More specifically, one or moreembodiments are directed to implementing a split shaped laser beam laserscribing process for, e.g., dicing applications.

To provide context, advantages for split beam scribing may involve animproved or more efficient use of laser pulse energy. For example, inlaser scribing, high pulse energy tends to ablate relatively large-sizedmaterial per pulse. However, the scribed trench is much less cleanversus low-energy pulse scribed trenches. This can lead to a moredifficult plasma etch process where, for the desired etch quality, muchmore effect is required to do plasma pre-cleaning of the scribed trenchbefore plasma etching. The impact is negative for plasma dicingthroughput. In some cases, plasma cleaning may not even make the scribedtrench feasible for etch. High energy ablation may also cause too deepan ablation than versus what may be desired. However, if high energyablation is avoided, a laser source is not used to its fullest capacity,which is costly. Additionally, lower pulse energy (but sufficiently highas to eliminate scribe induced delamination and other defects) resultsin lower throughput scribing. However, since it can be implemented toablate materials more gently, the trench may be cleaned in a more facilemanner by a plasma process. In accordance with embodiments describedherein, with a split beam process, the overall throughput and quality ofdicing is well balanced.

To provide additional context, in a hybrid wafer or substrate dicingprocess involving an initial laser scribe and subsequent plasma etch ofa coated wafer, a femtosecond laser may be applied to remove the maskand device layers on the dicing street until the silicon substrate isexposed. A plasma etch follows to separate dies to realize diesingulation. Typically, a Gaussian beam profile is used for the scribingprocess. However, a Gaussian beam profile shows its limitation with thefollowing two different situations: (1) when a wide kerf is demanded;(2) when a smooth sidewall in combination with high scribing throughputis needed for a typical narrow kerf width.

In accordance with one or more embodiments of the present invention, thelaser intensity control of spatially split beams is implemented forimproving laser scribing process in hybrid laser dicing. In additionalembodiments, split laser beam control of spatially shaped beams isimplemented for improving laser scribing process in hybrid laser dicingprocessing schemes.

As such, in an aspect of the present invention, a combination of a splitbeam laser scribing process with a plasma etching process may be used todice a semiconductor wafer into singulated integrated circuits. FIG. 1is a Flowchart 100 representing operations in a method of dicing asemiconductor wafer including a plurality of integrated circuits, inaccordance with an embodiment of the present invention. FIGS. 2A-2Cillustrate cross-sectional views of a semiconductor wafer including aplurality of integrated circuits during performing of a method of dicingthe semiconductor wafer, corresponding to operations of Flowchart 100,in accordance with an embodiment of the present invention.

Referring to operation 102 of Flowchart 100, and corresponding FIG. 2A,a mask 202 is formed above a semiconductor wafer or substrate 204. Themask 202 is composed of a layer covering and protecting integratedcircuits 206 formed on the surface of semiconductor wafer 204. The mask202 also covers intervening streets 207 formed between each of theintegrated circuits 206.

In accordance with an embodiment of the present invention, forming themask 202 includes forming a layer such as, but not limited to, aphoto-resist layer or an I-line patterning layer. For example, a polymerlayer such as a photo-resist layer may be composed of a materialotherwise suitable for use in a lithographic process. In one embodiment,the photo-resist layer is composed of a positive photo-resist materialsuch as, but not limited to, a 248 nanometer (nm) resist, a 193 nmresist, a 157 nm resist, an extreme ultra-violet (EUV) resist, or aphenolic resin matrix with a diazonaphthoquinone sensitizer. In anotherembodiment, the photo-resist layer is composed of a negativephoto-resist material such as, but not limited to, poly-cis-isoprene andpoly-vinyl-cinnamate.

In another embodiment, forming the mask 202 involves forming a layerdeposited in a plasma deposition process. For example, in one suchembodiment, the mask 202 is composed of a plasma deposited Teflon orTeflon-like (polymeric CF₂) layer. In a specific embodiment, thepolymeric CF₂ layer is deposited in a plasma deposition processinvolving the gas C₄F₈.

In another embodiment, forming the mask 202 involves forming awater-soluble mask layer. In an embodiment, the water-soluble mask layeris readily dissolvable in an aqueous media. For example, in oneembodiment, the water-soluble mask layer is composed of a material thatis soluble in one or more of an alkaline solution, an acidic solution,or in deionized water. In an embodiment, the water-soluble mask layermaintains its water solubility upon exposure to a heating process, suchas heating approximately in the range of 50-160 degrees Celsius. Forexample, in one embodiment, the water-soluble mask layer is soluble inaqueous solutions following exposure to chamber conditions used in alaser and plasma etch singulation process. In one embodiment, thewater-soluble mask layer is composed of a material such as, but notlimited to, polyvinyl alcohol, polyacrylic acid, dextran,polymethacrylic acid, polyethylene imine, or polyethylene oxide. In aspecific embodiment, the water-soluble mask layer has an etch rate in anaqueous solution approximately in the range of 1-15 microns per minuteand, more particularly, approximately 1.3 microns per minute.

In another embodiment, forming the mask 202 involves forming aUV-curable mask layer. In an embodiment, the mask layer has asusceptibility to UV light that reduces an adhesiveness of theUV-curable layer by at least approximately 80%. In one such embodiment,the UV layer is composed of polyvinyl chloride or an acrylic-basedmaterial. In an embodiment, the UV-curable layer is composed of amaterial or stack of materials with an adhesive property that weakensupon exposure to UV light. In an embodiment, the UV-curable adhesivefilm is sensitive to approximately 365 nm UV light. In one suchembodiment, this sensitivity enables use of LED light to perform a cure.

In an embodiment, semiconductor wafer or substrate 204 is composed of amaterial suitable to withstand a fabrication process and upon whichsemiconductor processing layers may suitably be disposed. For example,in one embodiment, semiconductor wafer or substrate 204 is composed of agroup IV-based material such as, but not limited to, crystallinesilicon, germanium or silicon/germanium. In a specific embodiment,providing semiconductor wafer 204 includes providing a monocrystallinesilicon substrate. In a particular embodiment, the monocrystallinesilicon substrate is doped with impurity atoms. In another embodiment,semiconductor wafer or substrate 204 is composed of a Ill-V materialsuch as, e.g., a III-V material substrate used in the fabrication oflight emitting diodes (LEDs).

In an embodiment, semiconductor wafer or substrate 204 has disposedthereon or therein, as a portion of the integrated circuits 206, anarray of semiconductor devices. Examples of such semiconductor devicesinclude, but are not limited to, memory devices or complimentarymetal-oxide-semiconductor (CMOS) transistors fabricated in a siliconsubstrate and encased in a dielectric layer. A plurality of metalinterconnects may be formed above the devices or transistors, and insurrounding dielectric layers, and may be used to electrically couplethe devices or transistors to form the integrated circuits 206.Materials making up the streets 207 may be similar to or the same asthose materials used to form the integrated circuits 206. For example,streets 207 may be composed of layers of dielectric materials,semiconductor materials, and metallization. In one embodiment, one ormore of the streets 207 includes test devices similar to the actualdevices of the integrated circuits 206.

Referring to operation 104 of Flowchart 100, and corresponding FIG. 2B,the mask 202 is patterned with a split laser beam laser scribing processto provide a patterned mask 208 with gaps 210, exposing regions of thesemiconductor wafer or substrate 204 between the integrated circuits206. In one such embodiment, the mask 202 is patterned with a splitshaped laser beam laser scribing process to provide the patterned mask208 with gaps 210. As such, the laser scribing process is used to removethe material of the streets 207 originally formed between the integratedcircuits 206. In accordance with an embodiment of the present invention,patterning the mask 202 with the split laser beam laser scribing processincludes forming trenches 212 partially into the regions of thesemiconductor wafer 204 between the integrated circuits 206, as depictedin FIG. 2B.

It is to be appreciated that, in an embodiment, a split laser beamprocessing scheme may be symmetric in that the beam is split acrossnumerous location at same intensity for each location. In otherembodiments, however, the beam splitting is asymmetric. Such anasymmetric arrangement be used as one of several passes along a waferused, as a combination, to ultimately scribe the wafer. As an example,FIG. 3 illustrates three different scenarios for asymmetric beamsplitting, in accordance with an embodiment of the present invention.

Referring to FIG. 3, part (a) shows a first arrangement of an asymmetriclenslet array where an input laser beam 302A is passed through a lensletarray 304A and on to a device wafer 306A. In this embodiment, lenslets308A increase in size from left to right, allowing increasing beam 310Aintensity from left to right across the device wafer 306A. Referringagain to FIG. 3, part (b) shows a second arrangement of an asymmetriclenslet array where an input laser beam 302B is passed through a lensletarray 304B and on to a device wafer 306B. In this embodiment, lenslets308B decrease in size from left to right, allowing decreasing beam 310Bintensity from left to right. Referring again to FIG. 3, part (c) showsa third arrangement of an asymmetric lenslet array where an input laserbeam 302C is passed through a lenslet array 304C and on to a devicewafer 306C. In this embodiment, lenslets 308C are varied in size fromleft to right, allowing varied beam 310C intensity from left to right.

FIG. 4A is a flowchart 400 representing operations of a laser scribingprocess with the intensity control of split beams, in accordance with anembodiment of the present invention. Referring to FIG. 4A, at operation402, a laser beam is input to or generated from a femto-second (Fs)laser oscillator. At operation 404, the beam is then passed throughsplit beam optics, such as and including lenslet arrays. At operation406, the output beam is used in a wafer scribing process.

FIG. 4B illustrates a Gaussian laser beam profile 410 for a laser beamsplitting process, in accordance with an embodiment of the presentinvention. Referring to FIG. 4B, the laser beam profile 410 may be aspatial profile of a femtosecond laser. FIG. 4C illustrates a Gaussianbeam propagation in the beam path 420, in accordance with an embodimentof the present invention. Referring to FIG. 4C, a first off focuslocation 422 is shown, a second off focus location 424 is shown, and onfocus location 426 is shown. Referring collectively, to FIGS. 4A-4C, aGaussian beam may be used in a split beam process. However, there may beissued with using such a split beam process, as is shown in FIG. 4C.

In another aspect, beam shaping is implemented for a beam splittingprocess. As an example, FIG. 5A is a flowchart 500 representingoperations of a laser scribing process with split intensity control of aline shaped beam, in accordance with an embodiment of the presentinvention. Referring to FIG. 5A, at operation 502, a laser beam is inputto or generated from a femto-second (Fs) laser oscillator. At operation504, the beam is then passed through beam shaping optics. At operation506, the beam is then passed through split beam optics, such as andincluding lenslet arrays. At operation 508, the output beam is used in awafer scribing process.

FIG. 5B illustrates a Gaussian laser beam profile 510 for a laser beamsplitting process, in accordance with an embodiment of the presentinvention. Referring to FIG. 5B, the laser beam profile 510 may be aspatial profile of a femtosecond laser. FIG. 5C illustrates a lineshaped flat top beam profile 520, in accordance with an embodiment ofthe present invention. Referring to FIGS. 5B and 5C, a laser beamprofile 510 is injected onto split laser beam optics to convert the beamfrom a Gaussian beam profile 510 to a line shaped flat top profile 520through the beam shaping optics. In one embodiment, the beam shapingoptics includes a diffractive optical element, one or more slitaperture, axicons, etc.

In an embodiment, as a comparison for a beam splitting application,using a single beam, a scribe process runs at 10 uJ pulse energy, 1 MHz,1000 mm/sec stage speed, using 2 passes. It takes approximately 1minutes to scribe an entire wafer. It takes approximately 3 minutes toperform plasma pre-cleaning to enable the final plasma etch. In anembodiment, workable parameters for a beam splitting applicationinclude, in the case of using a one-to-two split beam, the scribeprocess runs at 800 kHz, 6 uJ pulse energy per split beam (a leadingbeam and a following beam coaxially aligned to scribe a single line),and 800 mm/sec stage speed, using 1 pass. In one such embodiment, ittakes approximately 5 minutes to scribe an entire wafer. It takesapproximately 1 minute to perform plasma pre-cleaning. It should beappreciated that since the linear stage movement takes three operations(acceleration to get desired speed before scribe start, scribe atdesired speed, deceleration after scribe), the acceleration anddeceleration phases take a significant portion of time compared to thereal scribe-on-wafer time, running at 1000 mm/sec. Versus 800 mm/sec,such a difference does not render much saving in over scribe time perpass (e.g., higher scribe speed demands longer time for accelerationand/or deceleration time; lower scribe speed requires shorter time foracceleration and/or deceleration time).

In an embodiment, a femtosecond-based laser is used as a source for asplit shaped laser beam scribing process. For example, in an embodiment,a laser with a wavelength in the visible spectrum plus the ultra-violet(UV) and infra-red (IR) ranges (totaling a broadband optical spectrum)is used to provide a femtosecond-based laser pulse, which has a pulsewidth on the order of the femtosecond (10⁻¹⁵ seconds). In oneembodiment, ablation is not, or is essentially not, wavelength dependentand is thus suitable for complex films such as films of the mask 202,the streets 207 and, possibly, a portion of the semiconductor wafer orsubstrate 204.

FIG. 6 illustrates the effects of using a laser pulse width in thefemtosecond range, picosecond range, and nanosecond range, in accordancewith an embodiment of the present invention. Referring to FIG. 6, byusing a laser beam in the femtosecond range, heat damage issues aremitigated or eliminated (e.g., minimal to no damage 602C withfemtosecond processing of a via 600C) versus longer pulse widths (e.g.,significant damage 602A with nanosecond processing of a via 600A). Theelimination or mitigation of damage during formation of via 600C may bedue to a lack of low energy recoupling (as is seen for picosecond-basedlaser ablation of 600B/602B) or thermal equilibrium (as is seen fornanosecond-based laser ablation), as depicted in FIG. 6.

Laser parameters selection, such as beam profile, may be critical todeveloping a successful laser scribing and dicing process that minimizeschipping, microcracks and delamination in order to achieve clean laserscribe cuts. The cleaner the laser scribe cut, the smoother an etchprocess that may be performed for ultimate die singulation. Insemiconductor device wafers, many functional layers of differentmaterial types (e.g., conductors, insulators, semiconductors) andthicknesses are typically disposed thereon. Such materials may include,but are not limited to, organic materials such as polymers, metals, orinorganic dielectrics such as silicon dioxide and silicon nitride.

A street between individual integrated circuits disposed on a wafer orsubstrate may include the similar or same layers as the integratedcircuits themselves. For example, FIG. 7 illustrates a cross-sectionalview of a stack of materials that may be used in a street region of asemiconductor wafer or substrate, in accordance with an embodiment ofthe present invention.

Referring to FIG. 7, a street region 700 includes the top portion 702 ofa silicon substrate, a first silicon dioxide layer 704, a first etchstop layer 706, a first low K dielectric layer 708 (e.g., having adielectric constant of less than the dielectric constant of 4.0 forsilicon dioxide), a second etch stop layer 710, a second low Kdielectric layer 712, a third etch stop layer 714, an undoped silicaglass (USG) layer 716, a second silicon dioxide layer 718, and a layerof photo-resist 720, with relative thicknesses depicted. Coppermetallization 722 is disposed between the first and third etch stoplayers 706 and 714 and through the second etch stop layer 710. In aspecific embodiment, the first, second and third etch stop layers 706,710 and 714 are composed of silicon nitride, while low K dielectriclayers 708 and 712 are composed of a carbon-doped silicon oxidematerial.

Under conventional laser irradiation (such as nanosecond-basedirradiation), the materials of street 700 behave quite differently interms of optical absorption and ablation mechanisms. For example,dielectrics layers such as silicon dioxide, is essentially transparentto all commercially available laser wavelengths under normal conditions.By contrast, metals, organics (e.g., low K materials) and silicon cancouple photons very easily, particularly in response to nanosecond-basedirradiation. In an embodiment, a line shaped profile laser beam laserscribing process is used to pattern a layer of silicon dioxide, a layerof low K material, and a layer of copper by ablating the layer ofsilicon dioxide prior to ablating the layer of low K material and thelayer of copper.

In case that the split shaped laser beam is a femtosecond-based laserbeam, in an embodiment, suitable femtosecond-based laser processes arecharacterized by a high peak intensity (irradiance) that usually leadsto nonlinear interactions in various materials. In one such embodiment,the femtosecond laser sources have a pulse width approximately in therange of 10 femtoseconds to 500 femtoseconds, although preferably in therange of 100 femtoseconds to 400 femtoseconds. In one embodiment, thefemtosecond laser sources have a wavelength approximately in the rangeof 1570 nanometers to 200 nanometers, although preferably in the rangeof 540 nanometers to 250 nanometers. In one embodiment, the laser andcorresponding optical system provide a focal spot at the work surfaceapproximately in the range of 3 microns to 15 microns, though preferablyapproximately in the range of 5 microns to 10 microns or between 10-15microns.

In an embodiment, the laser source has a pulse repetition rateapproximately in the range of 200 kHz to 10 MHz, although preferablyapproximately in the range of 500 kHz to 5 MHz. In an embodiment, thelaser source delivers pulse energy at the work surface approximately inthe range of 0.5 uJ to 100 uJ, although preferably approximately in therange of 1 uJ to 5 uJ. In an embodiment, the laser scribing process runsalong a work piece surface at a speed approximately in the range of 500mm/sec to 5 m/sec, although preferably approximately in the range of 600mm/sec to 2 m/sec.

The scribing process may be run in single pass only, or in multiplepasses, but, in an embodiment, preferably 1-2 passes. In one embodiment,the scribing depth in the work piece is approximately in the range of 5microns to 50 microns deep, preferably approximately in the range of 10microns to 20 microns deep. In an embodiment, the kerf width of thelaser beam generated is approximately in the range of 2 microns to 15microns, although in silicon wafer scribing/dicing preferablyapproximately in the range of 6 microns to 10 microns, measured at thedevice/silicon interface.

Laser parameters may be selected with benefits and advantages such asproviding sufficiently high laser intensity to achieve ionization ofinorganic dielectrics (e.g., silicon dioxide) and to minimizedelamination and chipping caused by underlayer damage prior to directablation of inorganic dielectrics. Also, parameters may be selected toprovide meaningful process throughput for industrial applications withprecisely controlled ablation width (e.g., kerf width) and depth. In anembodiment, a line shaped profile laser beam laser scribing process issuitable to provide such advantages.

It is to be appreciated that the dicing or singulation process could bestopped after the above described laser scribing in a case that thelaser scribing is used to pattern the mask as well as to scribe fullythrough the wafer or substrate in order to singulate the dies.Accordingly, further singulation processing would not be required insuch a case. However, the following embodiments may be considered incases where laser scribing alone is not implemented for totalsingulation.

Referring now to optional operation 106 of Flowchart 100, anintermediate post mask-opening cleaning operation is performed. In anembodiment, the post mask-opening cleaning operation is a plasma-basedcleaning process. In a first example, as described below, theplasma-based cleaning process is reactive to the regions of thesubstrate 204 exposed by the gaps 210. In the case of a reactiveplasma-based cleaning process, the cleaning process itself may form orextend trenches 212 in the substrate 204 since the reactive plasma-basedcleaning operation is at least somewhat of an etchant for the substrate204. In a second, different, example, as is also described below, theplasma-based cleaning process is non-reactive to the regions of thesubstrate 204 exposed by the gaps 210.

In accordance with a first embodiment, the plasma-based cleaning processis reactive to exposed regions of the substrate 204 in that the exposedregions are partially etched during the cleaning process. In one suchembodiment, Ar or another non-reactive gas (or the mix) is combined withSF₆ for a highly-biased plasma treatment for cleaning of scribedopenings. The plasma treatment using mixed gases Ar+SF₆ under high-biaspower is performed for bombarding mask-opened regions to achievecleaning of the mask-opened regions. In the reactive breakthroughprocess, both physical bombardment from Ar and SF₆ along with chemicaletching due to SF₆ and F-ions contribute to cleaning of mask-openedregions. The approach may be suitable for photoresist orplasma-deposited Teflon masks 202, where breakthrough treatment leads tofairly uniform mask thickness reduction and a gentle Si etch. Such abreakthrough etch process, however, may not be best suited for watersoluble mask materials.

In accordance with a second embodiment, the plasma-based cleaningprocess is non-reactive to exposed regions of the substrate 204 in thatthe exposed regions are not or only negligible etched during thecleaning process. In one such embodiment, only non-reactive gas plasmacleaning is used. For example, Ar or another non-reactive gas (or themix) is used to perform a highly-biased plasma treatment both for maskcondensation and cleaning of scribed openings. The approach may besuitable for water-soluble masks or for thinner plasma-deposited Teflon202. In another such embodiment, separate mask condensation and scribedtrench cleaning operations are used, e.g., an Ar or non-reactive gas (orthe mix) highly-biased plasma treatment for mask condensation is firstperformed, and then an Ar+SF₆ plasma cleaning of a laser scribed trenchis performed. This embodiment may be suitable for cases whereAr-cleaning is not sufficient for trench cleaning due to too thick of amask material. Cleaning efficiency is improved for thinner masks, butmask etch rate is much lower, with almost no consumption in a subsequentdeep silicon etch process. In yet another such embodiment,three-operation cleaning is performed: (a) Ar or non-reactive gas (orthe mix) highly-biased plasma treatment for mask condensation, (b)Ar+SF₆ highly-biased plasma cleaning of laser scribed trenches, and (c)Ar or non-reactive gas (or the mix) highly-biased plasma treatment formask condensation. In accordance with another embodiment of the presentinvention, a plasma cleaning operation involves first use of a reactiveplasma cleaning treatment, such as described above in the first aspectof operation 106. The reactive plasma cleaning treatment is thenfollowed by a non-reactive plasma cleaning treatment such as describedin association with the second aspect of operation 106.

Referring to operation 108 of Flowchart 100, and corresponding FIG. 2C,the semiconductor wafer 204 is etched through the gaps 210 in thepatterned mask 208 to singulate the integrated circuits 206. Inaccordance with an embodiment of the present invention, etching thesemiconductor wafer 204 includes ultimately etching entirely throughsemiconductor wafer 204, as depicted in FIG. 2C, by etching the trenches212 initially formed with the split shaped laser beam laser scribingprocess.

In an embodiment, patterning the mask with the laser scribing processinvolves forming trenches in the regions of the semiconductor waferbetween the integrated circuits, and plasma etching the semiconductorwafer involves extending the trenches to form corresponding trenchextensions. In one such embodiment, each of the trenches has a width,and each of the corresponding trench extensions has the width.

In accordance with an embodiment of the present invention, the resultingroughness of mask opening from laser scribing can impact die sidewallquality resulting from the subsequent formation of a plasma etchedtrench. Lithographically opened masks often have smooth profiles,leading to smooth corresponding sidewalls of a plasma etched trench. Bycontrast, a conventional laser opened mask can have a very rough profilealong a scribing direction if improper laser process parameters areselected (such as spot overlap, leading to rough sidewall of plasmaetched trench horizontally). Although the surface roughness can besmoothened by additional plasma processes, there is a cost andthroughput hit to remedying such issues. Accordingly, embodimentsdescribed herein may be advantageous in providing a smoother scribingprocess from the laser scribing portion of the singulation process.

In an embodiment, etching the semiconductor wafer 204 includes using aplasma etching process. In one embodiment, a through-silicon via typeetch process is used. For example, in a specific embodiment, the etchrate of the material of semiconductor wafer 204 is greater than 25microns per minute. An ultra-high-density plasma source may be used forthe plasma etching portion of the die singulation process. An example ofa process chamber suitable to perform such a plasma etch process is theApplied Centura® Silvia™ Etch system available from Applied Materials ofSunnyvale, Calif., USA. The Applied Centura® Silvia™ Etch systemcombines the capacitive and inductive RF coupling, which gives much moreindependent control of the ion density and ion energy than was possiblewith the capacitive coupling only, even with the improvements providedby magnetic enhancement. This combination enables effective decouplingof the ion density from ion energy, so as to achieve relatively highdensity plasmas without the high, potentially damaging, DC bias levels,even at very low pressures. This results in an exceptionally wideprocess window. However, any plasma etch chamber capable of etchingsilicon may be used. In an exemplary embodiment, a deep silicon etch isused to etch a single crystalline silicon substrate or wafer 204 at anetch rate greater than approximately 40% of conventional silicon etchrates while maintaining essentially precise profile control andvirtually scallop-free sidewalls. In a specific embodiment, athrough-silicon via type etch process is used. The etch process is basedon a plasma generated from a reactive gas, which generally afluorine-based gas such as SF₆, C₄F₈, CHF₃, XeF₂, or any other reactantgas capable of etching silicon at a relatively fast etch rate. In anembodiment, the mask layer 208 is removed after the singulation process,as depicted in FIG. 2C. In another embodiment, the plasma etchingoperation described in association with FIG. 2C employs a conventionalBosch-type dep/etch/dep process to etch through the substrate 204.Generally, a Bosch-type process consists of three sub-operations:deposition, a directional bombardment etch, and isotropic chemical etchwhich is run through many iterations (cycles) until silicon is etchedthrough.

Accordingly, referring again to Flowchart 100 and FIGS. 2A-2C, waferdicing may be preformed by initial ablation using a split shaped laserbeam laser scribing process to ablate through a mask layer, throughwafer streets (including metallization), and partially into a siliconsubstrate. Die singulation may then be completed by subsequentthrough-silicon deep plasma etching. A specific example of a materialsstack for dicing is described below in association with FIGS. 8A-8D, inaccordance with an embodiment of the present invention.

Referring to FIG. 8A, a materials stack for hybrid laser ablation andplasma etch dicing includes a mask layer 802, a device layer 804, and asubstrate 806. The mask layer, device layer, and substrate are disposedabove a die attach film 808 which is affixed to a backing tape 810. Inan embodiment, the mask layer 802 is a water soluble layer such as thewater soluble layers described above in association with mask 202. Thedevice layer 804 includes an inorganic dielectric layer (such as silicondioxide) disposed above one or more metal layers (such as copper layers)and one or more low K dielectric layers (such as carbon-doped oxidelayers). The device layer 804 also includes streets arranged betweenintegrated circuits, the streets including the same or similar layers tothe integrated circuits. The substrate 806 is a bulk single-crystallinesilicon substrate.

In an embodiment, the bulk single-crystalline silicon substrate 806 isthinned from the backside prior to being affixed to the die attach film808. The thinning may be performed by a backside grind process. In oneembodiment, the bulk single-crystalline silicon substrate 806 is thinnedto a thickness approximately in the range of 50-100 microns. It isimportant to note that, in an embodiment, the thinning is performedprior to a laser ablation and plasma etch dicing process. In anembodiment, the photo-resist layer 802 has a thickness of approximately5 microns and the device layer 804 has a thickness approximately in therange of 2-3 microns. In an embodiment, the die attach film 808 (or anysuitable substitute capable of bonding a thinned or thin wafer orsubstrate to the backing tape 810) has a thickness of approximately 20microns.

Referring to FIG. 8B, the mask 802, the device layer 804 and a portionof the substrate 806 are patterned with a split shaped laser beam laserscribing process 812 to form trenches 814 in the substrate 806.Referring to FIG. 8C, a through-silicon deep plasma etch process 816 isused to extend the trench 814 down to the die attach film 808, exposingthe top portion of the die attach film 808 and singulating the siliconsubstrate 806. The device layer 804 is protected by the mask layer 802during the through-silicon deep plasma etch process 816.

Referring to FIG. 8D, the singulation process may further includepatterning the die attach film 808, exposing the top portion of thebacking tape 810 and singulating the die attach film 808. In anembodiment, the die attach film is singulated by a laser process or byan etch process. Further embodiments may include subsequently removingthe singulated portions of substrate 806 (e.g., as individual integratedcircuits) from the backing tape 810. In one embodiment, the singulateddie attach film 808 is retained on the back sides of the singulatedportions of substrate 806. Other embodiments may include removing themask layer 802 from the device layer 804. In an alternative embodiment,in the case that substrate 806 is thinner than approximately 50 microns,the split shaped laser beam laser scribing process 812 is used tocompletely singulate substrate 806 without the use of an additionalplasma process.

A single process tool may be configured to perform many or all of theoperations in a hybrid line shaped profile laser beam ablation andplasma etch singulation process. For example, FIG. 9 illustrates a blockdiagram of a tool layout for laser and plasma dicing of wafers orsubstrates, in accordance with an embodiment of the present invention.

Referring to FIG. 9, a process tool 900 includes a factory interface 902(FI) having a plurality of load locks 904 coupled therewith. A clustertool 906 is coupled with the factory interface 902. The cluster tool 906includes one or more plasma etch chambers, such as plasma etch chamber908. A laser scribe apparatus 910 is also coupled to the factoryinterface 902. The overall footprint of the process tool 900 may be, inone embodiment, approximately 3500 millimeters (3.5 meters) byapproximately 3800 millimeters (3.8 meters), as depicted in FIG. 9.

In an embodiment, the laser scribe apparatus 910 houses a laser assemblyconfigured to provide a split laser beam. In one such embodiment, thelaser assembly is configured to provide a split shaped laser beam. In aparticular such embodiment, the laser beam is a femto-second based laserbeam.

In an embodiments, the laser assembly is configured to provide the splitshaped laser beam as a symmetrically split laser beam. In anembodiments, the laser assembly is configured to provide the splitshaped laser beam as an asymmetrically split laser beam. In anembodiment, the laser assembly is configured to provide the split shapedlaser beam as a line shaped flat top beam profile.

In an embodiment, the laser is suitable for performing a laser ablationportion of a hybrid laser and etch singulation process, such as thelaser ablation processes described above. In one embodiment, a moveablestage is also included in laser scribe apparatus 910, the moveable stageconfigured for moving a wafer or substrate (or a carrier thereof)relative to the laser. In a specific embodiment, the laser is alsomoveable. The overall footprint of the laser scribe apparatus 910 maybe, in one embodiment, approximately 2240 millimeters by approximately1270 millimeters, as depicted in FIG. 9.

In an embodiment, the one or more plasma etch chambers 908 is configuredfor etching a wafer or substrate through the gaps in a patterned mask tosingulate a plurality of integrated circuits. In one such embodiment,the one or more plasma etch chambers 908 is configured to perform a deepsilicon etch process. In a specific embodiment, the one or more plasmaetch chambers 808 is an Applied Centura® Silvia™ Etch system, availablefrom Applied Materials of Sunnyvale, Calif., USA. The etch chamber maybe specifically designed for a deep silicon etch used to createsingulate integrated circuits housed on or in single crystalline siliconsubstrates or wafers. In an embodiment, a high-density plasma source isincluded in the plasma etch chamber 908 to facilitate high silicon etchrates. In an embodiment, more than one etch chamber is included in thecluster tool 906 portion of process tool 900 to enable highmanufacturing throughput of the singulation or dicing process.

The factory interface 902 may be a suitable atmospheric port tointerface between an outside manufacturing facility with laser scribeapparatus 910 and cluster tool 906. The factory interface 902 mayinclude robots with arms or blades for transferring wafers (or carriersthereof) from storage units (such as front opening unified pods) intoeither cluster tool 906 or laser scribe apparatus 910, or both.

Cluster tool 906 may include other chambers suitable for performingfunctions in a method of singulation. For example, in one embodiment, inplace of an additional etch chamber, a deposition chamber 912 isincluded. The deposition chamber 912 may be configured for maskdeposition on or above a device layer of a wafer or substrate prior tolaser scribing of the wafer or substrate. In one such embodiment, thedeposition chamber 912 is suitable for depositing a photo-resist layer.In another embodiment, in place of an additional etch chamber, a wet/drystation 914 is included. The wet/dry station may be suitable forcleaning residues and fragments, or for removing a mask, subsequent to alaser scribe and plasma etch singulation process of a substrate orwafer. In yet another embodiment, in place of an additional deep siliconetch chamber, a plasma etch chamber is included and is configured forperforming a plasma-based cleaning process. In an embodiment, ametrology station is also included as a component of process tool 900.

Embodiments of the present invention may be provided as a computerprogram product, or software, that may include a machine-readable mediumhaving stored thereon instructions, which may be used to program acomputer system (or other electronic devices) to perform a processaccording to embodiments of the present invention. In one embodiment,the computer system is coupled with process tool 900 described inassociation with FIG. 9. A machine-readable medium includes anymechanism for storing or transmitting information in a form readable bya machine (e.g., a computer). For example, a machine-readable (e.g.,computer-readable) medium includes a machine (e.g., a computer) readablestorage medium (e.g., read only memory (“ROM”), random access memory(“RAM”), magnetic disk storage media, optical storage media, flashmemory devices, etc.), a machine (e.g., computer) readable transmissionmedium (electrical, optical, acoustical or other form of propagatedsignals (e.g., infrared signals, digital signals, etc.)), etc.

FIG. 10 illustrates a diagrammatic representation of a machine in theexemplary form of a computer system 1000 within which a set ofinstructions, for causing the machine to perform any one or more of themethodologies described herein, may be executed. In alternativeembodiments, the machine may be connected (e.g., networked) to othermachines in a Local Area Network (LAN), an intranet, an extranet, or theInternet. The machine may operate in the capacity of a server or aclient machine in a client-server network environment, or as a peermachine in a peer-to-peer (or distributed) network environment. Themachine may be a personal computer (PC), a tablet PC, a set-top box(STB), a Personal Digital Assistant (PDA), a cellular telephone, a webappliance, a server, a network router, switch or bridge, or any machinecapable of executing a set of instructions (sequential or otherwise)that specify actions to be taken by that machine. Further, while only asingle machine is illustrated, the term “machine” shall also be taken toinclude any collection of machines (e.g., computers) that individuallyor jointly execute a set (or multiple sets) of instructions to performany one or more of the methodologies described herein.

The exemplary computer system 1000 includes a processor 1002, a mainmemory 1004 (e.g., read-only memory (ROM), flash memory, dynamic randomaccess memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM(RDRAM), etc.), a static memory 1006 (e.g., flash memory, static randomaccess memory (SRAM), MRAM, etc.), and a secondary memory 1018 (e.g., adata storage device), which communicate with each other via a bus 1030.

Processor 1002 represents one or more general-purpose processing devicessuch as a microprocessor, central processing unit, or the like. Moreparticularly, the processor 1002 may be a complex instruction setcomputing (CISC) microprocessor, reduced instruction set computing(RISC) microprocessor, very long instruction word (VUW) microprocessor,processor implementing other instruction sets, or processorsimplementing a combination of instruction sets. Processor 1002 may alsobe one or more special-purpose processing devices such as an applicationspecific integrated circuit (ASIC), a field programmable gate array(FPGA), a digital signal processor (DSP), network processor, or thelike. Processor 1002 is configured to execute the processing logic 1026for performing the operations described herein.

The computer system 1000 may further include a network interface device1008. The computer system 1000 also may include a video display unit1010 (e.g., a liquid crystal display (LCD), a light emitting diodedisplay (LED), or a cathode ray tube (CRT)), an alphanumeric inputdevice 1012 (e.g., a keyboard), a cursor control device 1014 (e.g., amouse), and a signal generation device 1016 (e.g., a speaker).

The secondary memory 1018 may include a machine-accessible storagemedium (or more specifically a computer-readable storage medium) 1032 onwhich is stored one or more sets of instructions (e.g., software 1022)embodying any one or more of the methodologies or functions describedherein. The software 1022 may also reside, completely or at leastpartially, within the main memory 1004 and/or within the processor 1002during execution thereof by the computer system 1000, the main memory1004 and the processor 1002 also constituting machine-readable storagemedia. The software 1022 may further be transmitted or received over anetwork 1020 via the network interface device 1008.

While the machine-accessible storage medium 1032 is shown in anexemplary embodiment to be a single medium, the term “machine-readablestorage medium” should be taken to include a single medium or multiplemedia (e.g., a centralized or distributed database, and/or associatedcaches and servers) that store the one or more sets of instructions. Theterm “machine-readable storage medium” shall also be taken to includeany medium that is capable of storing or encoding a set of instructionsfor execution by the machine and that cause the machine to perform anyone or more of the methodologies of the present invention. The term“machine-readable storage medium” shall accordingly be taken to include,but not be limited to, solid-state memories, and optical and magneticmedia.

In accordance with an embodiment of the present invention, amachine-accessible storage medium has instructions stored thereon whichcause a data processing system to perform a method of dicing asemiconductor wafer having a plurality of integrated circuits. Themethod includes forming a mask above the semiconductor wafer, the maskcomposed of a layer covering and protecting the integrated circuits. Themask is then patterned with a split shaped laser beam laser scribingprocess to provide a patterned mask with gaps, exposing regions of thesemiconductor wafer between the integrated circuits. The semiconductorwafer is then plasma etched through the gaps in the patterned mask tosingulate the integrated circuits.

Thus, hybrid wafer dicing approaches using a split laser beam laserscribing process and plasma etch process have been disclosed.

What is claimed is:
 1. A method of dicing a semiconductor wafercomprising a plurality of integrated circuits, the method comprising:forming a mask above the semiconductor wafer, the mask comprising alayer covering and protecting the integrated circuits; patterning themask with a split shaped laser beam laser scribing process to provide apatterned mask with gaps, exposing regions of the semiconductor waferbetween the integrated circuits, wherein the split shaped laser beamlaser scribing process comprises a one-to-two split beam running atapproximately 800 kHz with an approximately 6 μj pulse energy per splitbeam and an approximately 800 mm/sec stage speed; and plasma etching thesemiconductor wafer through the gaps in the patterned mask to singulatethe integrated circuits.
 2. The method of claim 1, wherein scribing withthe split shaped laser beam laser scribing process comprises scribingwith a symmetrically split laser beam.
 3. The method of claim 1, whereinscribing with the split shaped laser beam laser scribing processcomprises scribing with an asymmetrically split laser beam.
 4. Themethod of claim 1, wherein scribing with the split shaped laser beamlaser scribing process comprises scribing with a line shaped flat topbeam profile.
 5. The method of claim 1, wherein scribing with the splitshaped laser beam laser scribing process comprises scribing with afemto-second based laser beam.
 6. The method of claim 1, whereinpatterning the mask with the laser scribing process comprises formingtrenches in the regions of the semiconductor wafer between theintegrated circuits, and wherein plasma etching the semiconductor wafercomprises extending the trenches to form corresponding trenchextensions.
 7. The method of claim 6, wherein each of the trenches has awidth, and wherein each of the corresponding trench extensions has thewidth.
 8. The method of claim 1, further comprising: subsequent topatterning the mask with the split shaped laser beam laser scribingprocess and prior to plasma etching the semiconductor wafer through thegaps, cleaning the exposed regions of the semiconductor wafer with aplasma process.
 9. A method of dicing a semiconductor wafer comprising aplurality of integrated circuits, the method comprising: laser scribingthe semiconductor wafer with a split shaped laser beam laser scribingprocess to singulate the plurality of integrated circuits, wherein thesplit shaped laser beam laser scribing process comprises a one-to-twosplit beam running at approximately 800 kHz with an approximately 6 μjpulse energy per split beam and an approximately 800 mm/sec stage speed;and subsequent to laser scribing the semiconductor wafer, performing aplasma-based cleaning operation to clean sidewalls of the singulatedplurality of integrated circuits.
 10. The method of claim 9, whereinscribing with the split shaped laser beam laser scribing processcomprises scribing with a symmetrically split laser beam.
 11. The methodof claim 9, wherein scribing with the split shaped laser beam laserscribing process comprises scribing with an asymmetrically split laserbeam.
 12. The method of claim 9, wherein scribing with the split shapedlaser beam laser scribing process comprises scribing with a line shapedflat top beam profile.
 13. The method of claim 9, wherein scribing withthe split shaped laser beam laser scribing process comprises scribingwith a femto-second based laser beam.